Kulicke & Soffa and ROHM Semiconductor Develop New CuFirst™ Hybrid Bonding Process
Provided By PR Newswire
Last update: Nov 13, 2024
SINGAPORE, Nov. 13, 2024 /PRNewswire/ -- Kulicke and Soffa Industries, Inc. (NASDAQ: KLIC) ("Kulicke & Soffa", "K&S", "we" or the "Company"), in collaboration with ROHM Co., Ltd (TYO: 6963) ("ROHM"), a producer of a wide-range of semiconductor devices, announces a new path to hybrid bonding leveraging Kulicke & Soffa's leading Fluxless Thermo-Compression (FTC) process.
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