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ACM Research Strengthens Atomic Layer Deposition Portfolio with Qualification of Thermal and Plasma-Enhanced ALD Furnace Tools

Provided By GlobeNewswire

Last update: Dec 10, 2024

FREMONT, Calif., Dec. 10, 2024 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced packaging applications, today announced the qualification of its Ultra Fn A Plasma-Enhanced Atomic Layer Deposition (PEALD) Furnace tool. The tool has achieved process qualification at a mainland China semiconductor customer, and is now entering mass production. ACM also announced that its Ultra Fn A Thermal Atomic Layer Deposition (Thermal ALD) Furnace tool, introduced in 2022, has successfully completed process qualification with another leading mainland China customer, demonstrating performance parameters that it believes match or exceed competitive tools.

Read more at globenewswire.com

ACM RESEARCH INC-CLASS A

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